The 10th International 3-D Architectures for Semiconductor Integration and Packaging Conference and Exhibition will be held December 11 – 13, 2013, Hyatt Regency Airport Hotel, Burlingame, CA.

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2012 3-D ASIP Conference Highlights

The 9th International 3-D Architectures for Semiconductor Integration and Packaging, conference, closed the 2012 3-D IC conference season with a great line-up of presentations. Speakers, attendees, sponsors and exhibitors all represented an outstanding cross-section of leaders in the 3-D community.

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Keynote speakers (l to r): Vinod Kariat (Cadence), Tom Pawlowski (Micron), Carl Engblom (Ericsson), Dave McCann (GLOBALFOUNDRIES) and Liam Madden (Xilinx)

Here is a sampling of comments from this year's participants:

One of the best conferences that I had attended. The speakers were all very relevant—they were not canned sales presentations. The agenda & schedule allowed for excellent networking as well.

I particularly found the format excellent—it promoted dialog with speakers on leading developments in 3-D packaging. It was well focused and not diluted with a bunch of parallel sessions, and plenty of breaks to follow up with the presenters.

It was indeed again a great conference. Looking forward to a great conference next year.

I consider this conference as one of the most interesting and promising conferences in the field of 3-D integration. And there were many opportunities for fruitful discussions during these 3 days.

Excellent conference; gets better every year.

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For questions regarding the conference please contact