3D Architectures for Semiconductor Intergration and Packaging December 10 through 12, 2014, Burlingame, California
 

Why Attend

Three days with an outstanding cross-section of leaders in the 3D industry. Join us and gain key insights into the technology and market landscape for device and systems integration and interconnect.

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Save the Date

30 Top-Industry Speakers + 3D ASIP Industry Innovators X 10 Years = 1 Dynamic Connection

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Speakers

3D ASIP targets senior-level technologists and business leaders to present at the conference on issues of key importance to the industry.

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Join Our Community

3D ASIP Conference Updates – follow all the latest news.

Social Media – Stay connected to 3D ASIP.

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Sponsors

2014 sponsorship and exhibit opportunities are now available. Click here for more information and to reserve your space today.

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2014 Platinum Sponsors

EV Group    Tezzaron Semiconductor Corp 

Location

Atrium at dusk

The Hyatt Regency San Francisco Airport is just a short drive from San Francisco International Airport (SFO), and only 15 minutes from downtown San Francisco. For commuters, the hotel is convenient to the Silicon Valley. The hotel has been recently updated, offers comfortable meeting space, and provides attendees and exhibitors excellent networking space.

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Register

Registration is now open! Click here to register now.

3D ASIP   December 10-12, 2014, Burlingame, California

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