2012 3-D ASIP Conference Dates Announced!

The dates for the 9th international 3-D Architectures for Semiconductor Integration and Packaging Conference and Exhibition have been announced: December 12 -14, 2012, Sofitel San Francisco Bay, Redwood City, CA USA.

This meeting is firmly established as a leading industry event in 3-D integration and packaging, attracting leaders from around the world as speakers and attendees. The conference format offers a unique opportunity to gain the latest technology and market insights from invited presentations by industry leaders on emerging and on-going 3-D integration and packaging efforts, as well as on topics relating to technology and industry trends impacting this important arena. Substantial opportunities to network with other industry colleagues attending this event are built into the program as well.

The 2012 agenda is now in development. Please check back for updates. Registration is open.

Click on the link below and a new window will open. Register now to get the early registration discounts on conference and preconference fees.

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Register for 2012 3-D ASIP Conference and Exhibition
PAY ONLINE

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Conference Fees:

 

 

 

 

Register before October 31 to receive the early registration rates. The conference registration fee will increase by $150 on November 1. Corporate Team Discounts are available. Conference fees include continental breakfasts, lunches, receptions, handouts, and proceedings.

Preconference Symposium registration fees include refreshments, handouts, and symposium proceedings.

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A block of rooms at the Sofitel San Francisco, Redwood City has been reserved at the conference rate of $169. Rooms must be reserved before Monday, November 19. Make reservations by calling 650.598.9000 and reference the RTI 3-D ASIP conference.

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Sponsor and exhibit opportunities are now available.

For questions regarding the conference, or for alternate payment methods, please contact