2012 Sponsors
Premier Sponsor
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101 Innovation Drive
San Jose, CA 95134
Phone: 408-544-7000
www.altera.com
Altera Corporation is the pioneer of programmable logic solutions, enabling system and semiconductor companies to rapidly and cost effectively innovate, differentiate, and win in their markets. Altera offers FPGAs, SoC FPGAs, CPLDs, and ASICs in combination with software tools, intellectual property, embedded processors and customer support. Altera’s hardware programmable solutions provide the flexibility of digital signal processors and microprocessors, with the power efficiency of standard cell ASICs and ASSPs. Altera’s solutions are used in a wide range of applications in a variety of end markets, including communications, broadcast, industrial, military, automotive, computer and storage, and medical.
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7700 South River Parkway
Tempe, AZ 85284
Phone: 480-305-2400
Fax: 480-305-2401
www.evgroup.com
EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. Through its flexible manufacturing model, EVG develops reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers' fab lines. Key products include wafer bonding, lithography/nanoimprint lithography (NIL), metrology, photoresist coating, cleaning and inspection equipment. www.EVGroup.com
Event Sponsor
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2655 Seely Avenue
San Jose, CA 95134
Phone: 408.943.1234
www.cadence.com-
Cadence, a global EDA leader, provides software, hardware, IP and services for the electronics industry. Based on its EDA360 strategy, the company's System, SoC, and Silicon Realization products allow design teams to create, integrate, and optimize silicon designs at lower cost and with higher quality and profitability.
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430 Indio Way
Sunnyvale, CA 94085
Phone: +1 408 940 0300
www.suss.com-
With over 60 years of engineering experience and thousands of active systems installed worldwide, SUSS MicroTec is amongst the leading suppliers of process equipment for semiconductors and related markets. The solution portfolio covers all performance steps for photomask and wafer processing ranging from cleaning, coating, baking, developing, aligning, to wafer bonding and is complemented by micro-optical components.
From Advanced Packaging to 3D Integration. SUSS MicroTec has been at the forefront of companies supporting the advanced packaging industry with dedicated lithography solutions. With the trend leading towards 3D architectures for IC integration and packaging, we support 3D Packaging and 3D Interconnect processes with precision equipment for thick resist and high topography applications, Through-Silicon-Via (TSV) manufacturing, bonding and de-bonding solutions, stacking technologies as well as products for the production of CMOS image sensors.
MEMS and Compound Semiconductor Manufacturing. With a full range of wafer-processing equipment and extensive experience in warped wafer handling solutions, SUSS MicroTec has positioned itself as the leader in high-volume Micro-Electro-Mechanical-Systems (MEMS) manufacturing. Our equipment is specifically designed to handle non-standard substrates like fragile compound semiconductors and incorporates specialized hardware such as coaters, aligners and bonders optimized for LED manufacturing.
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1415 Bond Street, Suite 111
Naperville, IL 60563
www.tezzaron.com/-
Tezzaron Semiconductor Corp. is a world leader in the design and manufacture of three-dimensional integrated circuits (3-D ICs) and silicon interposers (2.5-D ICs). Tezzaron leads the 3-D IC industry, having demonstrated fully functional devices in 2004. It has since delivered dozens of custom 3-D products to commercial, academic, and government organizations and continues to create new solutions using its unique technology.
