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	Attend this conference to gain critical insights on Market Impacts and Analysis End-user Perspectives 3-D Integration and Packaging Technologies Design Methodology and Tools Manufacturing Issues and Solutions
	Targeting senior-level technologists and business managers from the world's leading companies and research institutions, and addresses the interests of a diverse group: Semiconductor fabs and packaging houses Equipment and materials suppliers Device designers Electronic systems producers Investment and business development advisors Electronic design automation vendors End-users and merchant foundaries University, government and related research programs Investment advisers and industry analysts

Industry experts around the world have come to view 3-D chips as a key enabler to continued performance improvements and market growth for the semiconductor industry. The challenges inherent in continued scaling in
2-D are simply too daunting and only offer incremental improvements in performance, and at higher cost. 3-D integration and packaging represents a paradigm shift for industry. It opens up entirely new pathways for advancement and offers new prospects for exponential growth in the semiconductor industry. The equipment market alone is anticipated to exceed $1 billion within the next few years. No doubt there are many challenges remaining though, before widescale implementation occurs. Those industry players, however, who understand these challenges, and offer new solutions, will reap the rewards over the coming decade. In fact the growth path offered by moving into the third dimension for semiconductor devices and systems may offer new opportunity for many years to come.

The first conference in this series took place in 2004, long before 3-D integration and through-silicon-vias (TSV) became the buzzwords they are today. This conference series offers a unique perspective of the techno-business aspects of this emerging commercial opportunity, combining technology with business, research developments with practical insights, to offer industry leaders the information needed to plan and move forward with confidence. This conference offers attendees the opportunity to learn from the presentations given by invited industry leaders, from the ample networking opportunities during the conference, and from the expanded exhibit offerings of this year’s event.

If you have questions about the upcoming event, please contact Matt Mecray at 207.829.6084 or by e-mail at mmecray@rti.org. For more information on the Technology Venture Forum Series Review the goals and objectives Browse through materials from our previous forums