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ALLVIA, Inc. provides Thru-Silicon Via foundry services to MEMS and Semiconductor Industries meeting the demands of advanced vertical interconnects and System-in-Package (SiP) solutions. Through Silicon Vias provide the shortest electrical path between two sides of silicon die, allow miniaturization through 3-D stacking, and support wafer level packaging (WLP) for RF and MEMS devices. With a full line of in-house processing equipment, ALLVIA offers services for prototyping as well as volume production runs for manufacturing TSVs, silicon etching, copper plating, photolithography, CMP, etc.
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BeSang Inc. is a leader in the design, development, and delivery of unsurpassed 3D IC solutions. Our cutting edge 3D IC technologies enable stacking multiple device layers in a vertical direction and provide ultra low-cost and high-performance solutions to CPU, DSP, ASIC, FPGA, SoC, DRAM, SRAM, Flash, image sensor and Solid State Drive applications. BeSang has high-value intellectual properties related to its proprietary single-chip 3D ICs. BeSang is a fabless semiconductor company headquartered in Beaverton, Oregon and a member of GSA (Global Semiconductor Alliance). BeSang is selected as one of Top 60 Emerging Startups by EE Times in 2009.
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EVG Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. Through its flexible manufacturing model, EVG develops reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers' fab lines. Key products include wafer bonding, lithography/nanoimprint lithography (NIL), metrology, photoresist coating, cleaning and inspection equipment.
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Founded in 1980, Lam Research Corporation (Fremont, California) is a major supplier of wafer fabrication equipment and services to the worldwide semiconductor industry. Our market-leading etch products address a broad range of applications, from conductor and dielectric etch to emerging MEMS, deep silicon, and 3-D IC applications. Lam's clean portfolio incorporates spin, linear, and plasma-based technologies, allowing implementation of customized yield-enhancing solutions. With our expertise and world-class global customer support, Lam Research is addressing many of today's most advanced semiconductor processing challenges.
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NEXX Systems is a semiconductor equipment company focused on 3-D and wafer level packaging processing, particularly through silicon vias (TSVs) and lead-free copper pillars. The company has two award winning product lines: Stratus, an electrodeposition system offering breakthrough technology that combines the process advantages of vertical wafer orientation with the economic advantages of parallel processing; and Apollo, a sputter deposition system designed to provide high throughput and productivity, with low consumables cost.
A critical enabling technology for TSVs is the electrochemical deposition copper filling step. Void-free filling is required for high yield implementation of 3-D devices. The Stratus and Apollo provide the highest yield in the industry at the lowest capital cost per wafer.
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RTI International is a not-for-profit research institute with 2,300 employees worldwide, dedicated to turning knowledge into practice. The Technology Venture Forum series examines the intersection between technology and business opportunity. The forums provide essential insights to managers in industry sectors where recent technology developments are challenging existing business models and creating new opportunities for growth.
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