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	Attend this conference to gain critical insights on Emerging 3D Chip Technologies Applications and Commercialization Design Methodology and Tools Manufacturing in 3D
	Targeting senior-level technologists and business managers from the world's leading companies and research institutions, and addresses the interests of a diverse group: Semiconductor fabs and packaging houses Equipment and materials suppliers Device designers and manufacturers Electronic systems producers Investment and business development advisors Electronic design automation vendors End-users and merchant foundaries University, government and related research programs Investment advisers and industry analysts

3D integration and packaging of semiconductor devices is gaining noticeable momentum within the semiconductor community. Once only a research curiosity, various forms of 3D integration and packaging are now reaching commercialization, and many continued advancements are expected in the near future. 3D architectures have clearly emerged as a serious contender in the challenges of meeting performance, cost, and size demands for semiconductor devices and products through this decade and beyond.

Building integrated circuits in 3D can decrease the size of devices while at the same time offering enhanced performance, a feature not lost upon today's designers dealing with interconnect issues in conventional 2D platforms. 3D architectures also allow the integration of different devices and circuit functions on the same chip-an additional advantage of key importance for the applications of today and tomorrow. The challenges the industry faces with interconnect issues are not easily solved on the current path of industry efforts. 3D architectures offer an alternative solution path to those challenges.

Continuing upon the success Continuing upon the success of the first two conferences conducted in 2004 and 2005, this year's "3D Architectures for Semiconductor Integration and Packaging" will assess key enabling technologies, industry dynamics, and applications driving commercialization of this emerging technology today, and will examine the opportunities and challenges that lay beyond. With presentations and participants from leading companies and organizations in the international community, the conference is aimed at providing the information that is critical to planning ongoing and future business and technical efforts in this important new arena. Attendees and speakers will have the opportunity to learn-from presentations and networking with industry leaders-the status of competing technology solutions, commercialization plans, and the key enablers to near- and long-term applications and market opportunities.