With increasing recognition of capabilities of 3-D chip integration and packaging, there now appears to be little doubt that 3-D chip interconnects and chip stacking have arrived and are here to stay. Significant commercial opportunities continue to evolve as evermore sophisticated approaches emerge from behind the scenes. The question is now becoming one of how far 3-D architectures can take the industry—beyond memory stacking and memory/processor integration to power amplifiers and perhaps to processors and integration of heterogeneous devices. 3-D integration and packaging can play a significant role in meeting the performance, cost, and size demands through this decade and beyond.

The year’s 2007 conference, 3-D Architectures for Semiconductor Integration and Packaging, will provide attendees and speakers the unique opportunity to explore and understand the technology and business implications of the trend toward 3-D device architectures in the semiconductor industry. With presentations and participants from leading companies and organizations in the international community, the conference is aimed at providing information that is critical to planning ongoing and future business and technical efforts that are impacted by the emerging capabilities of 3-D integration and packaging.