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2009

HPC Adoption '09
Examining Technology and Business Drivers
for High Performance Computing in a Data Driven World


May 11–13, 2009
Hyatt Regency San Francisco Airport Hotel,
Burlingame, California

2008

3D architectures for
Semiconductor Integration and Packaging

Momentum Builds – Examining Routes to Success

November 17 – 19, 2008
Hyatt Regency San Francisco Airport Hotel,
Burlingame, California

2007

3D architectures for
Semiconductor Integration and Packaging

Going Mainstream – Defining the Technology and market Opportunities

Oct 22-24, 2007
Hyatt Regency San Francisco Airport Hotel,
Burlingame, California

2006

3D architectures for
Semiconductor Integration and Packaging

Assessing Technological Developments, Applications, and Key Enablers

Oct 31-Nov 2, 2006
San Francisco Airport Marriott,
Burlingame, California

2005

3D architectures for
Semiconductor Integration and Packaging

Insight into Advanced Technologies, Initiatives, Challenges, and Opportunities

June 13-15, 2005
Wyndham Buttes Resort & Hotel,
Tempe, Arizona


Next-Generation Thermal Management
Materials and Systems

Challenges, Opportunities, and Technology Solutions
for Microscale Cooling in Photonics and Electronics


June 15-17, 2005
Wyndham Buttes Resort & Hotel,
Tempe, Arizona


2004

3D architectures for
Semiconductor Integration and Packaging

Understanding the Impact on Materials, Processes, and Markets

April 13-15, 2004
Hyatt Regency San Francisco Airport Hotel,
Burlingame, California


2002
Application and Commercialization of
Next-Generation Thermal Management Materials and Systems
for Cooling and Power Conversion

October 28-30, 2002
Dallas/Fort Worth Airport Marriott Hotel North,
Irving, Texas


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